Description
Crystalbond™ 555-HMP
Mid-range melting point of 150 ºF (66 ºC)
Use 555-HMP for low stress machining processes, dry plasma etching or silicon wafers, de-paneling copper plated Teflon boards, and dicing ceramic green tape. Transparent in thin cross-sections and soluble in hot water.
Quantity: One stick (rectangular bar ⅝” × 1” × 7”)
Typical Applications:
Machining advanced ceramics
Lapping and polishing optical components
Dicing ceramic substrates
Dicing semiconductor wafers
Dicing ferrites, glasses and piezoelectrics
Dicing metal and optical single crystals
Mounting cross-sections for SEM
Backfilling components for support
Dry plasma etching
All images shown are for illustration purposes only. Actual product may vary
Product Code: AREMT-CRYS-0001W
