Description
Crystalbond™ 555
Low melting point of 120 ºF (49 ºC).
Use 555 for low stress machining processes, dry plasma etching or silicon wafers, de-paneling copper plated Teflon boards, and dicing ceramic green tape. Transparent in thin cross-sections and soluble in hot water.
Quantity: One stick (rectangular bar ⅝” × 1” × 7”)
Typical Applications:
Machining advanced ceramics
Lapping and polishing optical components
Dicing ceramic substrates
Dicing semiconductor wafers
Dicing ferrites, glasses and piezoelectrics
Dicing metal and optical single crystals
Mounting cross-sections for SEM
Backfilling components for support
Dry plasma etching
All images shown are for illustration purposes only. Actual product may vary
Product Code: AREMT-CRYS-0003W
